High-Speed Data Transfer: Enables efficient communication under high-bandwidth scenarios, critical for performance-intensive applications. It ensures low-latency and high-throughput interconnects between chiplets.

Protocol Compliance Checking: Validates designs against UCIe (Universal Chiplet Interconnect Express) specifications, ensuring reliability and adherence to industry standards.

Chiplet-to-Chiplet Connectivity: Facilitates seamless interoperability between chiplets from different vendors, enabling modular and scalable system designs.

Power Management Validation: Optimizes energy consumption by validating power-saving features, ensuring efficient operation across varying workloads.

Error Injection Support: Simulates fault conditions to assess system resilience and robustness, helping identify and mitigate potential vulnerabilities.

Scalability Testing: Ensures reliable interconnect functionality as the number of chiplets increases, supporting future system expansion.

Advanced Debugging Tools: Provides integrated tracing and analysis capabilities to identify and resolve issues efficiently during development.

End-to-End Data Integrity: Ensures accurate and reliable data transmission across chiplets, minimizing errors and data loss in complex systems.

Flexible Lane Configuration: Supports a variety of configurations, from x1 to x16, allowing customization based on performance and design requirements.

Backward Compatibility: Ensures seamless integration with existing legacy systems, enabling gradual upgrades without compatibility issues.