Universal Chiplet Interconnect Express — the open die-to-die interconnect standard enabling multi-vendor chiplet ecosystems, advanced 2.5D/3D packaging, and scalable disaggregated SoC designs.
UCIe (Universal Chiplet Interconnect Express) is the open industry standard for die-to-die connectivity, enabling chiplets from different vendors to communicate with consistent signaling and protocol semantics. Supported by Intel, AMD, ARM, Samsung, TSMC, and 80+ industry members, UCIe is the foundation of the emerging chiplet economy.
Xtremesilica's UCIe IP core delivers the complete PHY, D2D adapter, and protocol tunnel layers for both Advanced (wafer-level, interposer) and Standard (organic substrate) package formats, with PCIe Gen 5/6 and CXL tunneling.